National Microelectronics Security Training Center Workshop

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Hi everyone, 

On Wednesday, October 5th, 2022, from 1pm to 5pm in room MAE 119, we will be holding a training on microelectronic packaging. This half-day workshop will consist of lectures covering the following:

 

·    History of Integrated Circuit (IC) Packaging

·    Advanced IC Packaging – System-on-a-Chip (SoC) Vs. System-in-Package (SiP)

·    Advanced IC Packaging – From 2D to 3D packaging

·    Interconnections within IC Packaging

·    Packaging Fabrication and Manufacturing Process

·    Physical Inspection for Advanced IC Packaging

 

We would like to invite all students to join this free training provided by the MEST center.

 

Please RSVP by using this link: https://forms.gle/vNJtKKYri9jPNzA19

 

Regards,

 

Daniel Johnson

Florida Institute for Cybersecurity Research

Department of Electrical and Computer Engineering

Engineer II, UF|Herbert Wertheim College of Engineering

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