National Microelectronics Security Training Center Workshop
Hi everyone,
On Wednesday, October 5th, 2022, from 1pm to 5pm in room MAE 119, we will be holding a training on microelectronic packaging. This half-day workshop will consist of lectures covering the following:
· History of Integrated Circuit (IC) Packaging
· Advanced IC Packaging – System-on-a-Chip (SoC) Vs.
System-in-Package (SiP)
· Advanced IC Packaging – From 2D to 3D packaging
· Interconnections within IC Packaging
· Packaging Fabrication and Manufacturing Process
· Physical Inspection for Advanced IC Packaging
We would like to invite all students to join this free training
provided by the MEST center.
Please RSVP by using this link: https://forms.gle/vNJtKKYri9jPNzA19
Regards,
Daniel Johnson
Florida Institute for Cybersecurity Research
Department of Electrical and Computer Engineering
Engineer II, UF|Herbert Wertheim College of Engineering
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